Xiaomi Corp confirmed on Monday that it will unveil a 3nm Xuanjie O1 chip on Thursday, after over four years of intensive R&D efforts.

The move will position Xiaomi in direct competition with leading global chipmakers, with the new chip poised to power Xiaomi's latest smartphones.

Lei Jun, CEO and chairman of Xiaomi, said via a post on Sina Weibo that the company's cumulative investment in Xuanjie chip exceeded over 13.5 billion yuan ($1.9 billion) by the end of April 2025.

Xiaomi now has a 2,500-strong semiconductor R&D team driving innovation, enforcing its position among China's top three semiconductor design firms in both R&D spending and team scale, Lei said.

Lei also emphasized the significance of the achievement: "Reaching this milestone demanded unwavering commitment, courage, and substantial technical and financial resources. The Xuanjie O1 marks the beginning of our journey to redefine high-end semiconductor capabilities in the global market."